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亞洲辦公室

香港九龍觀塘成業街
成業工業大廈12樓15B

第三方檢測中心

Evans Analytical Group
EAG is the world's leading, fully integrated, independent laboratory network. They provide global analytical services focused on surface analysis and materials characterization. They also provide the broadest range of electronic testing services to help bring your products to market.
Website: http://www.cea.com/

半導體編程 / 真空包裝服務

Dry packing is the process of putting moisture-sensitive plastic surface-mount devices in moisture-resistant bags or moisture barrier bags (see Fig. 1) to prevent them from absorbing moisture from the atmosphere. Moisture ingress into plastic packages can result in popcorn cracking during board mounting. Popcorn cracking refers to package cracking caused by abrupt vaporization of internal package moisture.


編帶包裝服務

  • Tape and Reel service.
  • Baking as required.
  • Barrier packaging.
  • Vacuum packaging.


芯片烘乾服務

A baking process widely used in integrated circuit (IC) manufacturing prior to printed circuit board assembly reduces the moisture level in the permeable surface mount device (SMD). Baking prevents moisture-induced delamination and popcorn failures.