The third party testing house

Evans Analytical Group
EAG is the world's leading, fully integrated, independent laboratory network. They provide global analytical services focused on surface analysis and materials characterization. They also provide the broadest range of electronic testing services to help bring your products to market.
Website: http://www.cea.com/

Semiconductor programming / Dry packing of components

Dry packing is the process of putting moisture-sensitive plastic surface-mount devices in moisture-resistant bags or moisture barrier bags (see Fig. 1) to prevent them from absorbing moisture from the atmosphere. Moisture ingress into plastic packages can result in popcorn cracking during board mounting. Popcorn cracking refers to package cracking caused by abrupt vaporization of internal package moisture.

Tape and Reel plus Device Packaging

• Tape and Reel service.
• Baking as required.
• Barrier packaging.
• Vacuum packaging.

Component baking

A baking process widely used in integrated circuit (IC) manufacturing prior to printed circuit board assembly reduces the moisture level in the permeable surface mount device (SMD). Baking prevents moisture-induced delamination and popcorn failures.